AT&S and EPCOS cooperate on embedding components

Leoben (pts009/10.07.2013/10:00)

AT&S Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S) is collaborating with EPCOS, a TDK Group Company, on developing technologies for embedding active and passive electronic components. The aims of the partnership include driving forward standardisation of these technologies, which play a decisive role in the fabrication of extremely miniaturised modules.

AT&S and EPCOS will enable smartphone and tablet PC manufacturers significantly improved access to space-saving integration technologies. These offer several advantages: embedding semiconductors and other electronic components in printed circuit boards or other module substrates supports the integration of numerous mobile device functions in an extremely small space, improves overall performance and extends battery life. (end)